"㈜인포비온"

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기술현황 - Ion Beam Process

Deposition Technology

  • Ion Beam Sputter Deposition (IBD, IBSD)

    Materials of the target are bombarded by an ion beam, which break the target down into sputtered atoms and they are deposited and constitute a thin film on the substrate.

    · Dense and pinhole free films with enhanced adhesion
    · Low 10-4 torr working pressure
    · Optically smooth surface
    · Flat and smooth interface for Multi-layer deposition
    · EUV Mirror and Damage free OLED deposition

  • IBSD with Ion Beam Assist

    During the ion beam sputter deposition process, the other ion beam can be assisted
    on the substrate, which can supply additional kinetic energy onto the ad-atoms of
    the surface.
    This additional energy supply could enhance the properties of the thin films and more satisfy the stoichiometry with reactive gas ion beam.
    If the assist energy source can be substituted with electron beam source, IBSD with
    electron beam assist.
    It could obtain a different result of the thin films with crystallized, more dense and
    hence transparent and conductive.

    · Stoichiometry control with reactive gas ion beam
    · The assist source can be substituted with electron beam source
       : Crystallized, more transparent and conductive, stress released.

Application

  • Flexible display

    Metal electrode layer
    TCO(Transparent conductive oxide)

  • Metal, Compound deposition

    Dental(Implant), Thin film solar cell, Semiconductor Architecture glass
    (IR, Thermal Absorption/Reflection)