"㈜인포비온"은

인류의 미래를 새롭게 창조해 나아갈 장비, 첨단소재 업체입니다

진공장비 - PVD

Cluster Sputter System

Details

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  • Cluster Sputter System is designed for homogeneous film coating up to 200 mm substrates. This sputter system is consist of the various process module for combinatorial deposition
    by a customer's needs. And this system can be used in optimized process for step coverage of trench and filling of via/through hole.

    Specification Configuration : Transfer system : 6 ~ 8 side transfer module
    Process module : max 4 process module
    Loading/unloading module : 25 slot cassette 2 module
    Wafer aligner & degassing module
    Sputter cathode : max 4 cathode per 1 process module
    Sample size : 3 ~ 8inch (75mm ~ 200mm)
    Transfer robot : Vacuum transfer robot (double pick-up)
    Base Pressure :
    - Process Chamber ≤ 1 x 10-7 torr
    - Transfer Chamber ≤ 1 x 10-6 torr
    Software interfaces : HMI programing base GUI software
    Application Power Device
    Multi-layer process
    Memory
    MRAM & Magnetic device
    Material reserch & development