"㈜인포비온"은

인류의 미래를 새롭게 창조해 나아갈 장비, 첨단소재 업체입니다

진공장비 - PVD

Cluster Sputter System

Detail

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  • Cluster Sputter System is designed for homogeneous coating of up to 200 mm substrates.
    The sputter is customer's complicated requests by process module configuration of various materials is possible. And this system is trench step coverage and filling process optimized.

    Specification Configuration : Transfer system : 6 ~ 8 side transfer module
    Process module : max 4 process module
    Loading/unloading module : 25 slot cassette 2 module
    Wafer aligner & degassing module
    Sputter cathode : max 4 cathode per 1 process module
    Sample size : 3 ~ 8inch (75mm ~ 200mm)
    Transfer robot : Vacuum transfer robot (double pick-up)
    Base Pressure :
    - Process Chamber ≤ 1 x 10-7 torr
    - Transfer Chamber ≤ 1 x 10-6 torr
    Software interfaces : HMI programing base GUI software
    Application Power Device
    Multi-layer process
    Memory
    MRAM & Magnetic device
    Material reserch & development